BGA 4-CHannel RF Reed Relays

B41 Ball Grid Array (BGA) Relays

The B41 contains four independent form A channels in one planar quad package. Coto’s Ball Grid Array (BGA) construction offers a breakthrough in reed relay performance. This patented technology1 allows for shorter RF paths in a controlled 50 Ω environment to minimize signal attentuation. The designer is now able to switch or pass signals with wider bandwidth and faster rise time than alternative technologies. This is particularly important in Mixed Signal IC testers. This four-in-one BGA packaging allows relays to be integrated easily on boards designed for surface mount processing.

1Protected by one or more of the following US Patents: 6025768, 6052045, 6294971, 6683518, RE38381 and other foreign patents.

  • Planar BGA Surface Mount
  • Ability to switch GHz signals
  • Rise time < 45 ρSec
  • ~50Ω Characteristic Impedance
  • Low Capacitance
  • Patented Design1
  • RoHS compliant solder (optional)*

Applications

  • IC Testers
  • In-Line Relay Testers
  • Memory Testers
  • Mixed Signal Testers
  • High Bandpass Applications

Product Schematics

3D Layout Models

B41

Environmental Ratings

Storage Temp: -35°C to +100°C; Operating Temp: -20°C to +85°C.
Moisture Sensitivity Level: Handle as J-STD-020B Level 5A. (This may be relaxed with B41ROHS, but only after qualification testing is complete.)
Consult the Coto Technology website (cototechnology.com) for recommended reflow profile for SnPb Eutectic and SAC Alloys.
Vibration Exposure: Sinusoidal vibration with an amplitude of 10g over a 10Hz to 2000Hz frequency range shall not cause damage to relay.

Order Information Notes

For RF Graph Performance, see “RF Graphs” section of the “Reed Relay Technical & Application Information”

Coto Technology